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Invitation

It is our pleasure to announce that the 18th International Symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Matrials and Packaging (ISMP-EMAP 2019) will be held at Hotel Aqua Palace, Busan, Korea, on November 13-15, 2019. This international conference is organized by KMEPS (the Korean Microelectronics and Packaging Society), and will address comprehensive coverage of recent advances in electronic packaging process and materials. Three days of technical sessions for oral and poster presentations. This will provide an excellent opportunity for researchers and engineers of academic institutes and industries to discuss recent advances and new technology directions. We cordially invite you to submit abstracts for the conference, and look forward to seeing you in Korea.

Plenary Speakers
Dr. Sayoon Kang, Vice President
Samsung Electro-Mechanics, Korea
“TBA” Biography
Prof. Takayuki Ohba, Ph.D.
Tokyo Institute of Technology (Tokyo Tech), Japan
“Wafer Level 3D Application for Tera-byte Node” Biography
Keynote Speakers
Dr. Kang-Wook Lee
VP, Package Development
SK Hynix, Korea
“Advanced Packaging Technologies and Reliability Challenges for Exa-era Applications” Biography
Prof. Muhannad S. Bakir
School of Electrical and Computer Engineering
Georgia Tech, USA
“From Monolithic to Polylithic Integrated Circuits: A New Age for Moore’s Law” Biography
Prof. Sung Yi
Mechanical and Materials Engineering Department
Portland State University, USA
“Could the reliability of solder joints be assessed accurately by using the Weibull distribution?” Biography
Prof. Wei-Ping Dow
Tenured Distinguished Professor Department of Chemical Engineering
National Chung Hsing University, Taiwan
“Electroplated Cu Bump with Ultra-Large Grain without Thermal Annealing and Kirkendall Void at the Interface of Cu/Sn Joint” Biography
Invited Speaker
  • Prof. Hsiang-Chen Hsu 
    I-Shou University
    “An Investigation on Scribing and Etching the Thin-film Stainless Steel Substrate using Ultrafast Laser”
  • Prof. Chih-Ming Chen
    National Chung Hsing University
    “Adhesion enhancement through co-silanization-assisted metallic immobilization on flexible polyimide”
  • Prof. C. Robert Kao
    National Taiwan University
    “Enhancement of Nano-Silver Chip Attachment by Using Transient Liquid Phase Reaction with Indium”
  • Prof. Mingyu Li 
    Harbin Institute of Technology
    “Micro-nano Joining by Nano Silver Sintering in Power Electronic Packaging”
  • Prof. G.P. Li 
    University of California, Irvine
    “A Perspective on Heterogeneous Integrated Edge Devices for Industry Internet of Things (IIOT) to Support Smart Manufacturing”
  • Dr. Santosh KUMAR
    Yole Développement
    “Technology and Market Trends of advanced SiP”
  • Dr. Onishi Tetsuya 
    Grand Joint Technology Ltd.
    “LED packaging Trend & super strong + ultra tough LED”
  • Dr. Yasumitsu Orii 
    NAGASE & CO., LTD.
    “Development of Materials Informatics Platform”
  • Dr. Osamu Suzuki 
    NAMICS Corp.
    “Recent Advances in Underfill for Flip Chip Applications”
  • Dr. Yasuhiro Morikawa
    Ulvac, Inc.
    “Manufacturing Technology Solution of Wafer / Panel Level Packaging for Heterogeneous Integration.”
  • Prof. Miyama Katsumi 
    Hokkaido University
    “Fabrication of fine pattern with imprint technique”
  • Prof. Hiroshi Nishikawa 
    Osaka University
    “Transient Liquid Phase Bonding using Sn-coated Cu Particles for High-temperature Applications”
  • Prof. Kyung W. Paik 
    Korea Advanced Institute of Science and Technology (KAIST)
    “A Study on the Dynamic Bending Reliability of Chip-in-Flex (CIF) Packages using
    Anisotropic Conductive Films (ACFs) Materials for Wearble Electronic Applications”
  • Dr. Jae-Sung Lim 
    HANA Micron Inc.
    “Silicon-based Flexible Electronics Enabled by HANAflex”
Symposium Topics

ISMP-EMAP2019 will include all fundamental and applied sciences and technologies related to the fields of electronic materials, devices, and packaging. Topics may include from, but are not limited to, the following areas:

  • Advanced Packaging Technologies
  • Electronic Materials for Interconnects and Packaging
  • Emerging Process for Interconnects and Packaging
  • PCB, Solder, and Assembly Process
  • Power Electronic Packaging
  • Sensors, LED, and Emerging Packaging Technology
  • Wearable and Printed Electronics
  • MEMS/NEMS Packaging and Applications
  • Reliability of Electronic Devices and Systems
  • Design Tools and Modeling
What’s New
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