It is our pleasure to announce that the 18th International Symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Matrials and Packaging (ISMP-EMAP 2019) will be held at Hotel Aqua Palace, Busan, Korea, on November 13-15, 2019. This international conference is organized by KMEPS (the Korean Microelectronics and Packaging Society), and will address comprehensive coverage of recent advances in electronic packaging process and materials. Three days of technical sessions for oral and poster presentations. This will provide an excellent opportunity for researchers and engineers of academic institutes and industries to discuss recent advances and new technology directions. We cordially invite you to submit abstracts for the conference, and look forward to seeing you in Korea.

Plenary Speakers
Dr. Sayoon Kang, Vice President
Samsung Electro-Mechanics, Korea
“TBA” Biography

Prof. Takayuki Ohba, Ph.D.
Tokyo Institute of Technology (Tokyo Tech), Japan
“Wafer Level 3D Application for Tera-byte Node” Biography


Keynote Speakers
Dr. Kang-Wook Lee
VP, Package Development
SK Hynix, Korea
“Advanced Packaging Technologies and Reliability Challenges for Exa-era Applications” Biography

Prof. Muhannad S. Bakir
School of Electrical and Computer Engineering
Georgia Tech, USA
“From Monolithic to Polylithic Integrated Circuits: A New Age for Moore’s Law” Biography

Prof. Sung Yi
Mechanical and Materials Engineering Department
Portland State University, USA
“Could the reliability of solder joints be assessed accurately by using the Weibull distribution?” Biography

Prof. Wei-Ping Dow
Tenured Distinguished Professor Department of Chemical Engineering
National Chung Hsing University, Taiwan
“Electroplated Cu Bump with Ultra-Large Grain without Thermal Annealing and Kirkendall Void at the Interface of Cu/Sn Joint” Biography


Symposium Topics

ISMP-EMAP2019 will include all fundamental and applied sciences and technologies related to the fields of electronic materials, devices, and packaging. Topics may include from, but are not limited to, the following areas:

  • Advanced Packaging Technologies
  • Electronic Materials for Interconnects and Packaging
  • Emerging Process for Interconnects and Packaging
  • PCB, Solder, and Assembly Process
  • Power Electronic Packaging
  • Sensors, LED, and Emerging Packaging Technology
  • Wearable and Printed Electronics
  • MEMS/NEMS Packaging and Applications
  • Reliability of Electronic Devices and Systems
  • Design Tools and Modeling


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