Welcome Message

Kyung W. Paik
General Chairs
It is our pleasure to announce that the 18th international Symposium on Microelectronics and Packaging (ISMP 2019) and 2019 EMAP(Electronic Materials and Packaging) will be held at the Hotel Aqua Palace, Pusan, Korea, during November 11~13th, 2019. This international conference will be organized by the KMEPS (the Korean Microelectronics and Packaging Society) and the EMAP Korean committee, and will address comprehensive coverage of recent advances in materials, processes, design and simulations, fabrication, reliability, and thermal management of electronic packaging. This conference will provide an excellent opportunity for researchers and engineers of academic institutes and industries to discuss recent advances and new electronic packaging technology directions. Three days of technical sessions for oral and poster presentations will be organized, and the program includes invited and keynote presentation from world-renowned speakers. In addition, you can also enjoy the wonderful night view of the Pusan beaches nearby the conference hotel. The ISMP-EMAP 2019 committees are cordially invite researchers, engineers, scientists and professors and students to submit abstracts and join the ISMP-EMAP 2019, and look forward to welcoming you in Pusan, Korea.