General Chair
- Seung-Boo Jung (Sungkyunkwan University)
- Kyung Wook Paik (Korea Advanced Institute of Science and Technology)
International Advisory Committee
- Chair
Yong-Bin Sun (Kyonggi University) - Taek-Soo Kim (Korea Advanced Institute of Science and Technology)
- Hiroshi Nishikawa (Osaka University, Japan)
- Joungho Kim (Korea Advanced Institute of Science and Technology)
- Yong M. Kim (Intel Corp., USA)
- Mitsumasa Koyanagi (Tohoku University)
- Saikumar Jayaraman (Intel Corp.)
- C. L. Gan (Nanyang Technological University)
Program Committee
- Chair
Sungdong Kim (Seoul National University of Science and Technology) - Kwang-Sung Choi (Electronics and Telecommunications Research Institute)
- Nam S. Kim (SK Hynix)
- Daeil Kwon (UNIST)
- Changhwan Choi (Hanyang University)
- Ki Ill Moon (SK Hynix)
Publication Committee
- Chair
Hyung-Ho Park (Yonsei University) - Young-Bae Park (Andong National University)
- Sung-Hoon Choa (Seoul National University of Science and Technology)
- Jae Pil Jung (University of Seoul)
Financial Committee
- Chair
Young C. Joo (Seoul National University) - SungSoon Park (Amkor Technology Korea)
- Sarah Eunkyung Kim (Seoul National University of Science and Technology)
- Byung Joon Kim (Andong National University)
- Jiwan Kim (Kyonggi University)
- Jaeho Lee (Hongik University)
Local Organization Committee
- Chair
Myungyung Jeong (Pusan National University) - Yong-Ho Ko (Korea Institute of Industrial Technology)
- Suck Won Hong (Pusan National University)
- Jeong-Won Yoon (Korea Institute of Industrial Technology)
- Jin Young Kim (Amkor Technology Korea)
Academia-Industry Cooperation Committee
- Chair
Young Jae Kim (Daeduck Electronics Co., Ltd.) - Min Hyun Kim (Hanmi Semiconductor Co., Ltd.)
- Nam Gi Kang (Korea Electronics Technology Institute)
- Jong Tae Moon (Hojun Able Co.)
- Gu-Sung Kim (Kangnam University)
- Hyuk Lee (Flex Com Co.)
- Sehoon Yoo (Korea Institute of Industrial Technology)
- Tae-Gon Lee (Samsung Electro-Mechanics)
Secretariat
- Minjin Kim (ISMP-EMAP2019)
- So-Yoon Park (Korean Microelectronics and Packaging Society)