Overview

ISMP-EMAP 2019 is the joint conference of the 18th International Symposium on Microelectronics and Packaging and 21st International Conference on Electronic Materials and Packaging.
ISMP is the top-tier international event that brings together the expertise in electronics packaging and microelectronic systems from academia to industry. EMAP is a unique event for the electronic packaging community. This year, these two conferences are held jointly to provide a bigger chance to exchange ideas and experiences from November 13 to 15, 2019 at the Hotel Aqua Palace, Busan, Korea.
As the conference site, Busan is the second-largest city in Korea and famous for tourist and shopping attractions as well as its astounding variety of fresh seafood. You will not forget the vibrant marketplace experience and the exceptional hospitality of Busan.
We look forward to seeing you in Busan at the ISMP-EMAP 2019.

Title The 18th International Symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Materials and Packaging
Date November 13-15, 2019
Venue Hotel Aqua Palace, Busan, Korea
Host Korea Microelectronics and Package Society
Program Welcome Reception, Plenary/ Keynote/ Invited/ Oral/ Poster Presentation, Banquet and Social Program
Website www.ismp-emap2019.org
Offcial Language English
Key Dates
Abstract submission August 23, 2019
Acceptance notification September 20, 2019
Pre-registration October 30, 2019
Manuscript submission December 31, 2019
Secretariat KMEPS(Korea Microelectronics and Packaging Society)
4F, 74, Dongjak-daero, Seocho-gu, Seoul, 06676, Korea
Tel.: +82-2-538-0962
E-mail : kmeps@ismp-emap2019.org
Publication Policy

The selected full manuscripts are going to be published in MDPI Coatings, Journal of Nanoscience and Nanotechnology(JNN) or Journal of Nanoelectronics and Optoelectronics(JNO) 2020 after the ISMP-EMAP 2019.