ISMP-EMAP 2019 will include all fundamental and applied sciences and technologies related to the fields of electronic materials, devices, and packaging. Topics may include from, but are not limited to, the following areas:

1. Advanced Packaging Technologies

Challenges and solutions in fan-out/fan-in wafer level packaging, panel level packaging, 3D integration, embedded structures, micro-bonding, TSVs, TEVs, TMVs, advanced substrates and interposers

2. Electronic Materials for Interconnects and Packaging

New interconnect materials (nano-scaled materials, nanowires, nano-interconnects, aerosol), carbon-based nanomaterials (graphene, CNT), adhesives(underfill, ACF, NCP), epoxy mold compound, bonding wire

3. Emerging Process for Interconnects and Packaging

Fine pitch bumping technology, bumpless bonding, ultrasonic bonding, induction bonding, laser bonding, self-align chip stacking, nano-bonding

4. PCB, Solder, and Assembly Process

Novel fabrication process for printed circuit board, electroplating process, surface finish, high reliable novel solder materials, low and high temperature solder, solder joint properties, interfacial reaction, solder printing process, reflow, wave soldering, press-fit process, novel assembly technologies

5. Power Electronic Packaging

Bonding materials for power electronics, TLP, ribbon bonding, wide bandgap power semiconductor devices (e.g. SiC, GaN, GaAs), novel cooling solutions (e.g. double-sided cooling, bond-wire-less), power embedding, very high voltage (>6.5kV) solutions

6. Sensors, LED, and Emerging Packaging Technology

Biosensor, chemical sensor, nano-packaging, emerging packaging technologies for bio-electronics and microfluidics, micro LED

7. Wearable and Printed Electronics

Stretchable electronic devices, stretchable substrates, flexible hybrid systems, printed/jetted (transparent) conductors, touch and large area sensors, signage and displays, paper electronics, printed thin film PV and photodetectors, energy storage and harvesting, wearable sensors/actuators

8. MEMS/NEMS Packaging and Applications

Challenges and solutions in processing, integration and packaging, new packaging approaches, TSVs in MEMS, bonding technologies, wafer bonding, micro-bonding

9. Reliability of Electronic Devices and Systems

New results at different levels of system integration (chip contacts, packages, assemblies and subsystems), characterization and test, failure diagnostic, methodical and equipment developments, upcoming challenges due to new system integration demands, innovative materials and extended application fields

10. Design Tools and Modeling

Mechanical, electrical, and thermal modeling and experimental verifications, signal and power integrity

* It should be noted that the program committee reserves the right to make a final decision on the session and presentation type of oral or poster regardless of author’s preference.